Intel Performance Tuning Protection Plan

Purchased Intel Performance Tuning Protection Plan for the i7 5930K. Now running at 4.5Ghz with memory at 3K. Running on a Corsair Hydro Series H110i GT ! ...

Guild Wars 2 - Bringing Antialiasing to the game

It's no surprise seeing another game slam onto the market lacking AA (Anti-Aliasing) features and Guild Wars 2 is no exception. MMORPG games tend to get...

Syfy's Defiance game Beta Screenshots

Below are a few screenshots from the upcoming Syfy "Defiance" game coming out on April 2, 2013. Defiance is a first of its kind where the game will be in close...

Steam Box, Steam for Linux

Valve has made one of its first steps toward a "Steam Box." Steam for Linux has been released today for Linux's operating system Ubuntu; complete with a...

Lowering game latency with WTFast tunneling

Taking a dive into WTFast  latency tunneling service -- is like your internet on steroids. Internet latency is a gamers worst nightmare. Any network...

Logitech G13 Advanced Gameboard

The G13 Advanced Gameboard is Logitech’s answer to gamers needs. It’s a fantastic light-weight, portable alternative for gamers who don’t want...

Rosewill Thor V2 Computer Case

Rosewill , the company behind quality hardware and affordable cases, debuted the redesigned Thor-V2 case earlier this year and has since become one of the...

Electronic Arts: Battlefield 3

As one of the most anticipated games released by EA (Electronic Arts), Battlefield 3 sets itself apart from its rivals with a great story-line and game play....

STMicroelectronics claims world’s first contactless wafer test

STMicroelectronics Produces World’s First Wafer Employing Fully Contactless TestingSTMicroelectronics, a European chip company, claims to have produced the first wafer tested wirelessly without the use of contact probes. Electromagnetic wafer sort (EMWS) technology, which is also the last stage of wafer fabrication prior to assembly and test of packaged ICs, was applied to a wafer of RFID (Radio Frequency Identification) ICs.

By testing the die wirelessly it can remove the need for dedicated test pads and reduce die area in most applications. The new EMWS technology comes from an R&D project called UTAMCIC (UHF TAG Antenna Magnetically Coupled to Integrated Circuit), led by Alberto Pagani, Giovanni Girlando and Alessandro Finocchiaro from STMicroelectronics, and Professor Giuseppe Palmisano from the University of Catania, which won a prestigious ‘Sesames Award’ in the ‘Production & Test’ category at Cartes and IDentification 2010 in Paris in December 2010.

“This breakthrough in testing technology demonstrates ST’s commitment to our zero-failure policy and especially benefits customers using our low-power RF circuits,” said Alberto Pagani, Test R&D and Competitive Intelligence, a developer of the new technology. “Contactless testing improves test coverage and, because the RF circuits, anticollision protocol and embedded antenna are tested under the same conditions they will operate under in the customer’s application, it will significantly enhance quality and reliability.”

Individual dice contain tiny antenna’s while the ATE supplies power to communicate with the dice via electromagnetic waves. From this point the number of test pads on the die are reduced, significantly shrinking the die size. Probes still need to supply power to test high-power products but ST’s novel technique enables the company full contactless testing of low-power circuits.


Comments

comments

 

 
Categories: Latest News, Top 10 Headlines.