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IBM to produce Micron’s Hybrid Memory Cube

New process creates 15-times-faster memory in 90% smaller package

IBM and Micron Technology, Inc. announced today that Micron will begin production of a new memory device built using the first commercial CMOS manufacturing technology to employ through-silicon vias (TSVs). IBM’s advanced TSV chip-making process enables Micron’s Hybrid Memory Cube (HMC) to achieve speeds 15 times faster than today’s technology.

IBM to Produce Micron's Hybrid Memory Cube in Debut of First Commercial, 3D Chip-Making Capability

Micron’s Hybrid Memory Cube features a stack of individual chips connected by vertical pipelines or “vias,” shown above. IBM’s new 3-D manufacturing technology, used to connect the 3D micro structure, will be the foundation for commercial production of the new memory cube.

IBM will present the details of its TSV manufacturing breakthrough at the IEEE International Electron Devices Meeting on December 5 in Washington, DC.

HMC parts will be manufactured at IBM’s advanced semiconductor fab in East Fishkill, N.Y., using the company’s 32nm, high-K metal gate process technology.

SOURCE: IBM

 


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