Intel Performance Tuning Protection Plan

Purchased Intel Performance Tuning Protection Plan for the i7 5930K. Now running at 4.5Ghz with memory at 3K. Running on a Corsair Hydro Series H110i GT ! ...

Guild Wars 2 - Bringing Antialiasing to the game

It's no surprise seeing another game slam onto the market lacking AA (Anti-Aliasing) features and Guild Wars 2 is no exception. MMORPG games tend to get...

Syfy's Defiance game Beta Screenshots

Below are a few screenshots from the upcoming Syfy "Defiance" game coming out on April 2, 2013. Defiance is a first of its kind where the game will be in close...

Steam Box, Steam for Linux

Valve has made one of its first steps toward a "Steam Box." Steam for Linux has been released today for Linux's operating system Ubuntu; complete with a...

Lowering game latency with WTFast tunneling

Taking a dive into WTFast  latency tunneling service -- is like your internet on steroids. Internet latency is a gamers worst nightmare. Any network...

Logitech G13 Advanced Gameboard

The G13 Advanced Gameboard is Logitech’s answer to gamers needs. It’s a fantastic light-weight, portable alternative for gamers who don’t want...

Rosewill Thor V2 Computer Case

Rosewill , the company behind quality hardware and affordable cases, debuted the redesigned Thor-V2 case earlier this year and has since become one of the...

Electronic Arts: Battlefield 3

As one of the most anticipated games released by EA (Electronic Arts), Battlefield 3 sets itself apart from its rivals with a great story-line and game play....

Globalfoundries announces 20nm process node can stack silicon

Globalfoundries has tooled its latest Fab 8 to allow for chip stacking on its upcoming 20nm process node.

Globalfoundries has been tooling up its new Fab 8 facility in the US and announced it will be able to use Through-Silicon Vias (TSV) in wafers fabbed with its 20nm process node. According to Globalfoundries, TSV will allow chip designers to stack chips for improved performance.

As Globalfoundries tools up for its 20nm process node the firm says TSVs, vertical holes etched in silicon and filled with copper, could allow chip designers to stack memory chips above processors. If Globalfoundries can make this cost effective, then it could bring significant power reductions by reducing the need for off-package chips.

Gregg Bartlett, CTO of Globalfoundries said, “Our approach is broad and collaborative, giving customers maximum choice and flexibility, while delivering cost savings, faster time-to-volume, and a reduction in the technical risk associated with developing new technologies. With the installation of TSV capabilities for 20nm technology in Fab 8, we are adding an important capability that will be supplemented by our joint development and manufacturing partnerships with companies across the semiconductor ecosystem, from design to assembly and test.”

Globalfoundries said first full-flow silicon incorporating TSVs will be rolling off its Fab 8 production line in the third quarter.

via inquirer


Comments

comments

 

 
Categories: Latest News, Top 10 Headlines.